BGA
BGA stands for Ball Grid Array (Ball
PCB grid array structure), which is an integrated circuit
An organic carrier board packaging method.
SOP
SOP (Small Out-Line Package Small?
Outline Package) is a very common
element is?
Pieces form.
TQFP
TQFP (thin quad flat package, namely thin
? Plastic corners flat package) thin quad flat package
? Low cost, low height leadframe packaging solutions.
Chip clips
The top sides of the jaws have inside hook design, the clip playing
? After opening inward from both sides of the chip can be steady grip
? Fixed contact.
Junrensi Electronic Technology（JRS）is the first independent research and development, production, sales IC test | burn | aging business, breaking the monopoly of Japan and the United States long-term the industry. Since its inception in 2006, has been committed to providing value-added services for the IC test / burn / aging industry. We are committed to the chip design companies, chip packaging and testing plant, chip wide range of applications (MEMORY, SDRAM, PC, AUDIO, VIDEO and communications, automotive electronics, etc.) to provide testing (Testing), aging (Burn-in), burn (Programming), and other programs.