With the rise of artificial intelligence and the Internet of Things, chips have entered an explosive period. Chip manufacturing is a process of turning sand into gold, from sand to wafer to chip. After the chip is packaged, it enters the testing stage. An indispensable testing consumable for testing is the Socket.

The test socket is a standard test adapter socket for testing the electrical performance and electrical connection of online components to check manufacturing defects and defective components.

Test socket function:

(1) Incoming material inspection

The chip needs to undergo quality inspection before use to pick out defective products, thereby increasing the yield of SMT. The quality of the chip cannot be seen by the naked eye. It must be tested by power-on. The current, voltage, inductance, resistance, and capacitance of the IC cannot be fully judged by the usual methods. It must be run through the test socket application function. Can be accurately judged.

(2) Repair inspection

The test socket can save maintenance judgment and analysis time, eliminate bad causes, reduce the frequency of mainboard reflow, and reduce the risk of scrapping the maintenance board. In addition, the IC may be damaged during the disassembly and removal process. The test socket can quickly detect the defective IC and reuse the IC that has been tested to reduce the cost of maintenance and picking, especially for ICs with high unit prices.

(3) Burning/Programming

The IC test socket is installed on the PCB to form an IC burning socket/IC programming socket/IC adapter. By connecting with a suitable burner, IC or module programming can be performed.

(4) Aging test

Component failures mainly occur at the beginning and the last tenth of the life cycle. Aging is to perform rigorous tests on components through working environment and electrical performance, and accelerate components in the first 10% of their life. Work, and make defects appear in a short period of time, try to find faults early.

Cost analysis:

The cost mainly depends on the number of pins, pitch, frequency, test requirements (such as temperature, current, life, heat dissipation, etc.) of the tested IC or module. The more pins, the higher the frequency, and the higher the test requirements It will increase the corresponding probe cost; the more pins and the smaller the spacing, it will increase the difficulty of orifice processing, increase the scrap rate of processing, and affect the overall price.

Test seat structure:

Bounce type: Suitable for automatic machine testing and burning of chips or modules. It can also be pressed manually or with a power-assisted fixture.

The structure and use of the probe:

The general probe material is glass copper, the outer layer is gold-plated, and consists of 4 parts: needle, needle tube, needle tail, and slingshot;

The mechanical life of the probe is not equal to the actual life of the probe, because the mechanical test uses a single probe in a laboratory environment and uses a vertical downward pressure test. In fact, there are often dozens or hundreds of them used at the same time. Because of the machining accuracy of the parts, it is impossible to guarantee that each probe is of equal height and verticality after installation. The load on the probe may not be the same, causing some probes to be damaged in advance. This affects the test life; in addition, the actual application environment often wears the needle due to dust and chip tin slag, but the life of the socket can be extended by replacing the probe.

The load borne by the double-headed probe is different, and only the fully functional probe can carry out reliable signal transmission. The prerequisite for good contact quality is:

Precautions for the use of the test socket:

After the test socket is used for a period of time, some tin slag and dust may remain on the tip of the needle. When it is seriously polluted or difficult to contact, you can clean the probe with an anti-static brush or precision electronic cleaner, and then blow out the test socket with an air gun Scattered dirt particles. Larger radial force may cause the probe to bend. Do not apply shear on the probe during cleaning. Do not use corrosive cleaning agents (such as thinner water, plate washing water, etc.), otherwise it will cause damage to the probe. Serious damage, even scrap.

When the test socket is not in use for a long time, it should be sealed with an anti-static bag and placed in a dry environment to prevent oxidation due to the storage environment, resulting in poor contact. When using it again, observe whether the probe is dirty or oxidized (black). If this phenomenon occurs, please clean or replace the probe before use.