•Compact design, increase the capacity of the aging test seat plate,

•Using a flip-top and screw-down structure, easy to operate;

•The pressure block structure is reasonable, the pressing speed is linearly controllable, the pressing force is stable and balanced, and the chip shell is uniformly stressed to ensure safety;

•The claw head of the probe is a concave arc shape, which can effectively support the solder ball, which can ensure stable contact performance and protect the solder ball and pad shape;

•Precise positioning slots and guide holes to ensure accurate IC positioning;

•Special IC carrier structure to protect the probe from damage by external forces;

•The probe, beryllium copper plated with hard gold, the service life is more than 100,000 times;

•Convenient probe replacement, low maintenance cost of test socket;

•The test base is made of high-strength and high-temperature insulation materials.