•Compact design, increase the capacity of the aging test seat plate,

•Using a flip-top and screw-down structure, easy to operate;

•The pressure block structure is reasonable, the pressing speed is linearly controllable, the pressing force is stable and balanced, and the chip shell is uniformly stressed to ensure safety;

•The claw head of the probe is concave arc shape, which can effectively support the solder ball, which can ensure stable contact performance and protect the solder ball and pad shape;

• Precise positioning slots and guide holes to ensure accurate IC positioning;

•Special IC carrier structure to protect the probe from external damage;

•The probe, beryllium copper plated with hard gold, has a service life of more than 100,000 times;

• Easy to replace the probe, low maintenance cost of the test socket;

•The test seat is made of high-strength and high-temperature insulation materials.