Focuses on the R&D and production of IC test sockets, aging sockets, and burn-in sockets.
Provide customers with integrated solutions for integrated circuit testing.
Integrated circuit aging test socket This product is used in aerospace, military industry, scientific research units and integrated circuit manufacturers. It can be equipped with imported aging tables, aging boards for components and high and low temperature testing, aging screening for connection: product model and specifications; IC-8J, IC-14J, IC-16J, IC-18J, IC-18J (K) wide span, IC-20J, IC-24J, IC-24Z narrow foot, IC-28J, IC-28J (K) wide Span, IC-40J main technical indicators
•Compact design to increase the capacity of the aging test seat plate.•Adopting a flip-top and spiral pressing structure, which is convenient to operate; Safe; • The claw head of the probe is concave arc shape, which can effectively support the solder ball, which can ensure stable contact performance and protect the solder ball and pad shape;
One: Incoming material inspection; the purchased IC will sometimes undergo quality inspection before use to pick out defective products, thereby increasing the SMT yield. The quality of the sales IC test socket is invisible to the naked eye, and must pass the power-on test. Using common methods to detect the current, voltage, inductance, resistance, and capacitance of the IC can not completely judge the quality of the IC; running the program through the IC test fixture application function can judge the quality of the IC.
The IC test socket is used to burn the program into the chip, and it needs the cooperation of the programmer to burn. Put the IC test socket in the socket above the programmer, and then put the IC chip in the socket for programming. So what are the functions of the IC test socket?
The IC test socket is mainly used to check the on-line single IC components and the open and short circuit conditions of each circuit network, as well as the function of analog devices and the logic function of digital devices. The user is able to fully achieve the functions and performance indicators specified in the design specification under harsh environmental conditions during the test. Simply put, the qualification of the test chip
Various IC automatic burning machines and testing machines, supporting chips in various packages (tape, tube mounting, tray), and automatic burning and testing of ICs in DIP, SDIP, SOP, SSOP, TSSOP, MSOP, etc. There is a solution.