Dongguan Junrensi Electronic Technology Co., Ltd.

Address: Factory No.34, Ludipu Factory, Huaide Community, Humen Town, Dongguan City, Guangdong Province




Contact:Mr. Zhang


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Product Image
Product parameters
Number pin number Pin pitch Remarks
TSOP-48-0.5-013 48 0.5
Product detailed parameters PDF view: Click to view
Product performance
Insulation resistance DC 500V 1000MΩ above
Withstand voltage AC 700V No abnormalities within one minute(0.65Pin pitch)
Contact resistance Measurement current 10mA Open-end voltage 20mV or less, 30mΩ or less
Operating temperature -65°C~+150°C
Service life 80000次以上

Note: TSOP48 divided into wide body and narrow body two. For details, consult JRS Company

Materials and components
Test seat PEI
Terminal inner layer Beryllium copper
Terminal surface selective gold-plated, nickel-plated bottom cover
Chip size
Test seat size
Terminal contact method

● Contact terminals arc greater than 270 ° design structure, so that the clamping strength, contact and reliable.

● Double contact structure, more stable contact.

Wide-body drawings

•This section seat clamshell shrapnel / under the pressure shrapnel two structures, using a one-time mold forming, good quality, life expectancy more than 100,000 times.

*There are two ways to connect the pedestal and the PCB:
1Contact (top plate, * completely replace the probe structure test seat)

•The use of floating plate structure, the effective protection of the needle, the needle's special head-shaped protrusions can pierce the oxide layer of solder ball without damaging the solder ball.

No ball for the 1C can test the ball


Is the first independent research and development, production, sales 1C test, burn, aging of the enterprises, breaking the United States and other countries said the United States long-term monopoly on the industry.

Since its establishment in 2006, the company has been devoting itself to providing value-added services for 1C testing, programming and aging industries.

We are committed to the chip design company, chip packaging and testing plant, chip a wide range of applications (MEMORY.SDRAM, PC, AUDIO, VIDEO and communications, automotive electronics, etc.)Provide Testing, Burn-in, Programming and other programs.

After years of development, the company has accumulated a wealth of experience and good reputation.

The main products are: BGA, CSP, QFN, MLF, PLCC, DIP, SSOP, SOP, TSOP, TSSOP, QFP, SOJ, SOT, etc. At the same time, we can provide high quality test socket according to the special needs of different customers.

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