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Dongguan Junrensi Electronic Technology Co., Ltd.

Address: Factory No.34, Ludipu Factory, Huaide Community, Humen Town, Dongguan City, Guangdong Province

Landline:+86-769-82885016

Fax:+86-769-82885276

Phone:+86-135-3773-1585

Contact:Mr. Zhang

E-mail:qingqiong1688@163.com

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【Origin Pic】

TSOP-48-0.5-013

  • Detail

  • Performance introduction

  • About us

Product parameters
Number pin number Pin pitch Remarks
TSOP-48-0.5-013 48 0.5
Product detailed parameters PDF view: Click to view
Product performance
Insulation resistance DC 500V 1000MΩ above
Withstand voltage AC 700V No abnormalities within one minute(0.65Pin pitch)
Contact resistance Measurement current 10mA Open-end voltage 20mV or less, 30mΩ or less
Operating temperature -65°C~+150°C
Service life 80000次以上

Note: TSOP48 divided into wide body and narrow body two. For details, consult JRS Company

Materials and components
Test seat PEI
Terminal inner layer Beryllium copper
Terminal surface selective gold-plated, nickel-plated bottom cover
Chip size
Test seat size
Terminal contact method

● Contact terminals arc greater than 270 ° design structure, so that the clamping strength, contact and reliable.

● Double contact structure, more stable contact.

Wide-body drawings
Precautions

•This section seat clamshell shrapnel / under the pressure shrapnel two structures, using a one-time mold forming, good quality, life expectancy more than 100,000 times.

*There are two ways to connect the pedestal and the PCB:
1Contact (top plate, * completely replace the probe structure test seat)
2welding

•The use of floating plate structure, the effective protection of the needle, the needle's special head-shaped protrusions can pierce the oxide layer of solder ball without damaging the solder ball.

No ball for the 1C can test the ball

JRS

It is a domestic company that independently develops, produces, and sells 1C testing, burning, and aging, breaking the long-term monopoly of Japan and the United States in the industry.

Since its establishment in 2006, the company has been devoting itself to providing value-added services for 1C testing, programming and aging industries.

We are committed to the chip design company, chip packaging and testing plant, chip a wide range of applications (MEMORY.SDRAM, PC, AUDIO, VIDEO and communications, automotive electronics, etc.)Provide Testing, Burn-in, Programming and other programs.

After years of development, the company has accumulated a wealth of experience and good reputation.

The main products are: BGA, CSP, QFN, MLF, PLCC, DIP, SSOP, SOP, TSOP, TSSOP, QFP, SOJ, SOT, etc. At the same time, we can provide high quality test socket according to the special needs of different customers.

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