1.Product structure & electrical performance is stable, easy to use.

2.Colloid using PEI & PES high and low temperature (-55 to +170 degrees)

4.Metal conductor using Japan NGK beryllium copper, fatigue and high and low temperature (-50 degrees +900 degrees) and excellent electrical conductivity.

5.Service life of 100,000 times.

•This section seat clamshell shrapnel / under the pressure shrapnel two structures, using a one-time mold forming, good quality, life expectancy more than 100,000 times.

*There are two ways to connect the pedestal and the PCB:
1Contact (top plate type, * completely replace probe structure test stand)
2welding

•The use of floating plate structure, the effective protection of the needle, the needle's special head-shaped protrusions can pierce the oxide layer of solder ball without damaging the solder ball.

No ball for the 1C can test the ball

Is the first independent research and development, production, sales 1C test, burn, aging of the enterprises, breaking the United States and other countries said the United States long-term monopoly on the industry.

Since its establishment in 2006, the company has been devoting itself to providing value-added services for 1C testing, programming and aging industries.

We are committed to the chip design company, chip packaging and testing plant, chip a wide range of applications (MEMORY.SDRAM, PC, AUDIO, VIDEO and communications, automotive electronics, etc.)Provide Testing, Burn-in, Programming and other programs.

After years of development, the company has accumulated a wealth of experience and good reputation.

The main products are: BGA, CSP, QFN, MLF, PLCC, DIP, SSOP, SOP, TSOP, TSSOP, QFP, SOJ, SOT, etc. At the same time, we can provide high quality test socket according to the special needs of different customers.