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Dongguan Junrensi Electronic Technology Co., Ltd.

Address: Factory No.34, Ludipu Factory, Huaide Community, Humen Town, Dongguan City, Guangdong Province

Landline:+86-769-82885016

Fax:+86-769-82885276

Phone:+86-135-3773-1585

Contact:Mr. Zhang

E-mail:qingqiong1688@163.com

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QFP-100-0.5-01

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Product Image
QFP-100-0.5-01
Product parameters
Number pin number Pin pitch Remarks
QFP-32-0.8-01 32 0.8
QFP-48-0.5-01 48 0.5
QFP-64-0.5-01 64 0.5
QFP-100-0.5-01 100 0.5
Contact force spring Product detailed parameter drawingsPDF: Click to view
15g - 180g contact distance between 0.2mm - 0.9mm Stainless steel, passivated
Parameter diagram
Product performance
Insulation resistance DC 100V 1000MΩ above
Withstand voltage AC 700V No abnormalities within one minute
Contact resistance Measurement current 10mA Open-end voltage 20mV or less, 30mΩ or less
Operating temperature -65°C~+150°C
Service life 100000 times or more
Materials and components
Test seat PEI
Terminal inner layer Beryllium copper
Terminal surface selective gold-plated, nickel-plated bottom cover
Chip size
Test seat size
Part Name Pin Count IC Body
A×B
IC Tip to Tip
C×D
Paralle Clamp
M
IC Height
E
Socket Dim
G×H
Type
QFP-32-0.8-0.1-JRS 32 7.6×7.6 9×9 8.7 1.4 30×40.5 CL
QFP-48-0.5-0.1-JRS 48 7.6×7.6 9×9 8.5 1.4 29×37 CL
QFP-64-0.5-0.1-JRS 64 10×10 12×12 11.6 1.4 32×40 CL
QFP-100-0.5-0.1-JRS 100 14×14 16×16 15.4 1.5 36×44 CL
QFP-48-0.5-JRS 48 7.6×7.6 9×9 / 1.4 24×24 DT
QFP-64-0.5-JRS 64 10×10 12×12 / 1.4 27×27 DT
QFP-80-0.5-JRS 80 12.6×12.6 14×14 / 1.4 29×29 DT
QFP-100-0.5-JRS 100 14×14 16×16 / 1.5 31×31 DT

*CL=Clamshell OT=Under pressure

Contact method
QFP 0.5 0.8

1.Product structure & electrical performance is stable, easy to use.

2.Colloid using PEI & PES high and low temperature (-55 to +170 degrees)

4.Metal conductor using Japan NGK beryllium copper, fatigue and high and low temperature (-50 degrees +900 degrees) and excellent electrical conductivity.

5.Service life of 100,000 times.

Precautions

•This section seat clamshell shrapnel / under the pressure shrapnel two structures, using a one-time mold forming, good quality, life expectancy more than 100,000 times.

*There are two ways to connect the pedestal and the PCB:
1Contact (top plate type, * completely replace probe structure test stand)
2welding

•The use of floating plate structure, the effective protection of the needle, the needle's special head-shaped protrusions can pierce the oxide layer of solder ball without damaging the solder ball.


No ball for the 1C can test the ball

JRS

Is the first independent research and development, production, sales 1C test, burn, aging of the enterprises, breaking the United States and other countries said the United States long-term monopoly on the industry.

Since its establishment in 2006, the company has been devoting itself to providing value-added services for 1C testing, programming and aging industries.

We are committed to the chip design company, chip packaging and testing plant, chip a wide range of applications (MEMORY.SDRAM, PC, AUDIO, VIDEO and communications, automotive electronics, etc.)Provide Testing, Burn-in, Programming and other programs.

After years of development, the company has accumulated a wealth of experience and good reputation.

The main products are: BGA, CSP, QFN, MLF, PLCC, DIP, SSOP, SOP, TSOP, TSSOP, QFP, SOJ, SOT, etc. At the same time, we can provide high quality test socket according to the special needs of different customers.