Dongguan Junrensi Electronic Technology Co., Ltd.

Address: Factory No.34, Ludipu Factory, Huaide Community, Humen Town, Dongguan City, Guangdong Province




Contact:Mr. Zhang


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Product parameters
Number model pin number Number model pin number Pin pitch
Double row double pin Single row pin
1 QFN16-0.4(3.0X3.0) 16 19 QFN20-0.4(3.0X3.0) 20 0.4
2 QFN32-0.4(4.0X4.0) 32 20 QFN28-0.4(4.0X4.0) 28 0.4
3 QFN40-0.4(5.0X5.0) 40 21 QFN36-0.4(5.0X5.0) 36 0.4
4 QFN48-0.4(6.0X6.0) 48 22 QFN52-0.4(6.0X6.0) 52 0.4
5 QFN56-0.4(7.0X7.0) 56 23 QFN60-0.4(7.0X7.0) 60 0.4
6 QFN64-0.4(8.0X8.0) 64 24 QFN68-0.4(8.0X8.0) 68 0.4
7 QFN80-0.4(9.0X9.0) 80 25 QFN76-0.4(9.0X9.0) 76 0.4
8 QFN88-0.4(10X10) 88 26 QFN92-0.4(10X10) 92 0.4
9 QFN104-0.4(12X12) 104 27 QFN108-0.4(12X12) 108 0.4
10 QFN16-0.5(3.0X3.0) 16 28 QFN12-0.5(3.0X3.0) 12 0.5
11 QFN24-0.5(4.0X4.0) 24 29 QFN20-0.5(4.0X4.0) 20 0.5
12 QFN32-0.5(5.0X5.0) 32 30 QFN28-0.5(5.0X5.0) 28 0.5
13 QFN40-0.5(6.0X6.0) 40 31 QFN36-0.5(6.0X6.0) 36 0.5
14 QFN48-0.5(7.0X7.0) 48 32 QFN44-0.5(7.0X7.0) 44 0.5
15 QFN56-0.5(8.0X8.0) 56 33 QFN52-0.5(8.0X8.0) 52 0.5
16 QFN64-0.5(9.0X9.0) 64 34 QFN60-0.5(9.0X9.0) 60 0.5
17 QFN72-0.5(10X10) 72 35 QFN68-0.5(10X10) 68 0.5
18 QFN88-0.5(12X12) 88 36 QFN84-0.5(12X12) 84 0.5
Contact force spring Product Detail Parameters Drawing PDF: Click to view
35g per pin (normal) Stainless steel, passivated
Parameter diagram
Product performance
Insulation resistance DC 100V 1000MΩ or more
Resistance to electricity AC100V has no abnormality in one minute
Contact resistance Measuring current 10mA open end voltage 20mV or less, 100MΩ or less
Operating temperature -40°C~+150°C
Service life More than 100000 times
Materials and components
Test seat PEI
Terminal inner layer Beryllium copper
Terminal surface selective gold plating, nickel plated bottom cover

The measurable chip is divided into single row single pin number, and double row double pin number

Measurable chip size range of 3 × 3 · 12 × 12mm (excluding 11 × 11mm)

Measurable chip thickness range 0.5 · 1.2mm (more than 1.2mm can be customized)

QFN 0.4 0.5

1.Product structure & electrical performance are stable, easy to use and operate.

2.Colloids use PEI & PES resistant to high and low temperatures (-55 to +170 degrees)

4.The use of Japanese metal NGK beryllium copper conductor, fatigue resistance and high and low temperature (-50 degrees +900 degrees) and excellent conductivity.

5.Service life of 100,000 times


•This type of carrier has two structures: flip-laminate/low-elastic shrapnel. It adopts one-time mold opening and has good quality and lifespan of more than 100,000 times.

*There are two ways to connect the carrier and the PCB:
1Contact (top plate type, * completely replace probe structure test stand)

•The use of floating plate structure, effective protection needle, the special head-shaped protrusion of the needle can pierce the oxide layer of the ball without damaging the ball.

For 1C ball can be tested


It is a domestic company that independently develops, produces, and sells 1C testing, burning, and aging, breaking the long-term monopoly of Japan and the United States in the industry.

Since its establishment in 2006, the company has been devoting itself to providing value-added services for 1C testing, programming and aging industries.

We are committed to the chip design company, chip packaging and testing plant, chip a wide range of applications (MEMORY.SDRAM, PC, AUDIO, VIDEO and communications, automotive electronics, etc.)Provide Testing, Burn-in, Programming and other programs.

After years of development, the company has accumulated a wealth of experience and good reputation.

The main products are: BGA, CSP, QFN, MLF, PLCC, DIP, SSOP, SOP, TSOP, TSSOP, QFP, SOJ, SOT, etc. At the same time, we can provide high quality test socket according to the special needs of different customers.