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Dongguan Junrensi Electronic Technology Co., Ltd.

Address: Factory No.34, Ludipu Factory, Huaide Community, Humen Town, Dongguan City, Guangdong Province

Landline:+86-769-82885016

Fax:+86-769-82885276

Phone:+86-135-3773-1585

Contact:Mr. Zhang

E-mail:qingqiong1688@163.com

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Your location  Home -> Product  ->  BGA  ->  FBGA-0.5X660(14X18)

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FBGA-0.5X660(14X18)

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  • Performance introduction

  • About us

Product parameters
Number pin number Pin pitch Remarks
BGA132-1.0X165(12X18) 165 1 This series of products can increase or decrease the terminal PIN number according to the chip range.
BGA152-1.0X165(14X18) 165 1
EMMC-0.5X196(11.5X13) 196 0.5
EMMC-0.5X196(12X16) 196 0.5
EMMC-0.5X196(12X18) 196 0.5
EMMC-0.5X196(14X18) 196 0.5
EMCP-0.5X200(11.5X13) 200 0.5
EMCP-0.5X200(12X13.5) 200 0.5
EMCP-0.5X200(12X16) 200 0.5
FBGA-0.5X660(14X18) 660 0.5
Insulation resistance Withstand voltage Contact resistance Operating temperature
DC100V 1000 Mohm and above AC100V has no abnormality within 1 minute Measurement current 10mA Open end voltage 20mV or less, 50mΩ or less (initial) -50℃~+150℃
Service life Operating force 外壳材料 Terminals spring
10000 times (machinery) 3 kg maximum PEI,PES Beryllium copper, selective gold plating, nickel-plated underlay Stainless steel, passivated
Product Detail Parameters Drawing PDF: Click to view
Product performance
Insulation resistance DC100V 1000MΩ or more
Resistance to electricity AC100V has no abnormality in one minute
Contact resistance Measurement current 10mA open end voltage 20mV or less, 80mn or less
Operating temperature -50°C~+150°C
Service life More than 100000 times
Materials and components
Test seat PEI
Terminal inner layer Beryllium copper
Terminal surface selective gold plating, nickel plated bottom cover
Chip size
Test seat size

BGA Flip cover

All limit frames can be replaced to support different sizes of IC1.
1.This type of carrier is a clamshell spring structure that uses a one-time open mold, with good quality and lifespan of more than 100,000 times.
2.Two ways (1) Top plate contact (2) Welding
3.High-precision limit box can be replaced, compatible with different sizes of IC
4.Floating plate structure, effective protection needle
5.Supports a PIN of 0.4 0.5 0.65 0.8 1.0 with a PIN of 960.

BGA push down

1.This type of carrier is a pressed elastic plate structure, which is formed by one-time mold opening. It is of good quality and has a lifespan of over 100,000 times.
2.There are two connection methods for the carrier and the PCB board. One contact method. One welding.
3.High-precision limit box can be replaced, compatible with different sizes of IC
4.Floating plate structure, effective protection needle
5.Supports a PIN of 0.4 0.5 0.65 0.8 1.0 with a PIN of 960.

Contact method

● The chip has solder ball or Wuxi ball can touch

● S-shaped spring arm, double contact design, contact stability

Product parameter units are: mm mm; all product specifications and sketches are subject to change without prior notice.


PIN value

1: As long as it is 0.4, 0.5, 0.65, 0.8, 1.0 pitch 1C can use our nest.

2: The full PIN carrier can be compatible with multiple models of IG, but it can not be guaranteed to be used. It is best to install needles according to their own needs, so that 100% can be used.

The meaning of the figure above is that as long as it is a multiple of 0.5 or inverse 5 can be used, according to your 1C pin

Precautions

•This type of carrier has two structures: flip-laminate/low-elastic shrapnel. It adopts one-time mold opening and has good quality and lifespan of more than 100,000 times.

*The carrier and the PCB have two connections:
1Contact (top plate type, * completely replace probe structure test stand)
2welding

•The use of floating plate structure, effective protection needle, the special head-shaped protrusion of the needle can pierce the oxide layer of the ball without damaging the ball.


For 1C ball can be tested

JRS

Is the first independent research and development, production, sales 1C test, burn, aging of the enterprises, breaking the United States and other countries said the United States long-term monopoly on the industry.

Since its establishment in 2006, the company has been devoting itself to providing value-added services for 1C testing, programming and aging industries.

We are committed to the chip design company, chip packaging and testing plant, chip a wide range of applications (MEMORY.SDRAM, PC, AUDIO, VIDEO and communications, automotive electronics, etc.)Provide Testing, Burn-in, Programming and other programs.

After years of development, the company has accumulated a wealth of experience and good reputation.

The main products are: BGA, CSP, QFN, MLF, PLCC, DIP, SSOP, SOP, TSOP, TSSOP, QFP, SOJ, SOT, etc. At the same time, we can provide high quality test socket according to the special needs of different customers.