Junrensi

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Dongguan Junrensi Electronic Technology Co., Ltd.

Address: Factory No.34, Ludipu Factory, Huaide Community, Humen Town, Dongguan City, Guangdong Province

Landline:+86-769-82885016

Fax:+86-769-82885276

Phone:+86-135-3773-1585

Contact:Mr. Zhang

E-mail:qingqiong1688@163.com

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Your location  Home -> Product  ->  IC Test Socket  ->  DDR1, 2, 3, 4 test seats

【Origin Pic】

DDR1, 2, 3, 4 test seats

  • Detail

  • Performance introduction

  • About us

Chip size
Test seat size
Structure introduction

•This type of carrier has two structures: flip-laminate/low-elastic shrapnel. It adopts one-time mold opening and has good quality and lifespan of more than 100,000 times.

*The carrier and the PCB have two connections:
1Contact (top plate type, * completely replace probe structure test stand)
2welding

•The use of floating plate structure, effective protection needle, the special head-shaped protrusion of the needle can pierce the oxide layer of the ball without damaging the ball.

For 1C ball can be tested

JRS

Is the first independent research and development, production, sales 1C test, burn, aging of the enterprises, breaking the United States and other countries said the United States long-term monopoly on the industry.

Since its establishment in 2006, the company has been devoting itself to providing value-added services for 1C testing, programming and aging industries.

We are committed to the chip design company, chip packaging and testing plant, chip a wide range of applications (MEMORY.SDRAM, PC, AUDIO, VIDEO and communications, automotive electronics, etc.)Provide Testing, Burn-in, Programming and other programs.

After years of development, the company has accumulated a wealth of experience and good reputation.

The main products are: BGA, CSP, QFN, MLF, PLCC, DIP, SSOP, SOP, TSOP, TSSOP, QFP, SOJ, SOT, etc. At the same time, we can provide high quality test socket according to the special needs of different customers.