Junrensi

+86-769-82885016

Search

Hot key words:BGAQFNQFPSOPQFN-TTQFP

Chinese

Product

Dongguan Junrensi Electronic Technology Co., Ltd.

Address: Factory No.34, Ludipu Factory, Huaide Community, Humen Town, Dongguan City, Guangdong Province

Landline:+86-769-82885016

Fax:+86-769-82885276

Phone:+86-135-3773-1585

Contact:Mr. Zhang

E-mail:qingqiong1688@163.com

4dhcpmingchen
Your location  Home -> Product  ->  IC Test Socket  ->  DDR2\3\4 test stand

【Origin Pic】

DDR2\3\4 test stand

  • Detail

  • Performance introduction

  • About us

Chip size
Test seat size
Structure introduction

•This type of carrier has two structures: flip-laminate/low-elastic shrapnel. It adopts one-time mold opening and has good quality and lifespan of more than 100,000 times.

*The carrier and the PCB have two connections:
1Contact (top plate type, * completely replace probe structure test stand)
2welding

•The use of floating plate structure, effective protection needle, the special head-shaped protrusion of the needle can pierce the oxide layer of the ball without damaging the ball.

For 1C ball can be tested

JRS

It is a domestic company that independently develops, produces, and sells 1C testing, burning, and aging, breaking the long-term monopoly of Japan and the United States in the industry.

Since its establishment in 2006, the company has been devoting itself to providing value-added services for 1C testing, programming and aging industries.

We are committed to the chip design company, chip packaging and testing plant, chip a wide range of applications (MEMORY.SDRAM, PC, AUDIO, VIDEO and communications, automotive electronics, etc.)Provide Testing, Burn-in, Programming and other programs.

After years of development, the company has accumulated a wealth of experience and good reputation.

The main products are: BGA, CSP, QFN, MLF, PLCC, DIP, SSOP, SOP, TSOP, TSSOP, QFP, SOJ, SOT, etc. At the same time, we can provide high quality test socket according to the special needs of different customers.